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dc.contributor.advisorIndrawan, Ivan
dc.contributor.advisorSembiring, Robi Arianta
dc.contributor.authorSinaga, Marta Uli
dc.date.accessioned2024-02-15T06:47:15Z
dc.date.available2024-02-15T06:47:15Z
dc.date.issued2023
dc.identifier.urihttps://repositori.usu.ac.id/handle/123456789/91258
dc.description.abstractOne of the problems that often occurs at the project location is the problem of overflowing river water which causes flooding, including around the construction of the Sei Wampu TOL bridge where the biggest problem is floods that overflow when it rains, so that the construction of the TOL bridge on the Sei Wampu River requires calculations. The planned flood discharge and water level will influence the planning of the bridge structure. The data is then processed using hydrological analysis and hydraulic analysis. Hydrological analysis includes calculating regional rainfall using the Polygon Thiessen method, analyzing rain distribution using Log Pearson Type III, calculating rain intensity and flood discharge using the HSS Nakayasu method. Meanwhile, hydraulic analysis uses HEC-RAS (Hydrology Engineering Center-River Analysis System) 5.0 supporting software to calculate the water level elevation value on the Sei Batang Panggang Toll Bridge in the Sei Batang Panggang River Area. From the results of the analysis, rainfall and flood discharge values were obtained at return periods of 2, 5, 10, 25 and 50 years and it was found that the existing water level elevation value did not exceed the flood water level value (TMA<MAB)en_US
dc.language.isoiden_US
dc.publisherUniversitas Sumatera Utaraen_US
dc.subjectRiveren_US
dc.subjectFlooden_US
dc.subjectPearson Type III Logen_US
dc.subjectRain Intensityen_US
dc.subjectFlood Dischargeen_US
dc.subjectHSS Nakayasuen_US
dc.subjectHEC-RASen_US
dc.subjectWater Level Elevationen_US
dc.subjectSDGsen_US
dc.titleEvaluasi Rancangan Elevasi Tinggi Muka Air pada Jembatan Tol Sei Wampu di Kawasan Sungai Sei Wampuen_US
dc.typeThesisen_US
dc.identifier.nimNIM190404040
dc.identifier.nidnNIDN0005127607
dc.identifier.nidnNIDN0004059005
dc.identifier.kodeprodiKODEPRODI22201#Teknik Sipil
dc.description.pages86 Halamanen_US
dc.description.typeSkripsi Sarjanaen_US


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